Skyscraper computer chips that would be smaller, faster and cheaper- FutureEnTech


Skyscraper computer chips that would be smaller, faster and cheaper

Researchers, led by an Indian-origin scientist, have found how to build high-rise chips that could leapfrog the performance of memory chips on today's circuit cards.Engineers have created a way to build silicon chip high-rises that will not only increase performance but also decrease costs when compared to their single-storied counterparts. For decades, the mantra of electronics has been smaller, faster, and cheaper. Now, Stanford engineers add a fourth word ­ taller.A Stanford team will reveal how to build high-rise chips that could leapfrog the performance of the single-story logic and memory chips on today's circuit cards. 

Stanford engineers have created a four-layer prototype high-rise chip. In this representation, the bottom and top layers are logic transistors. Sandwiched between them are two layers of memory. The vertical tubes are nanoscale electronic "elevators" that connect logic and memory, allowing them to work together to solve problems. (Image credit: Max Shulaker)

Those circuit cards are like busy cities in which logic chips compute and memory chips store data. But when the computer gets busy, the logic and memory connectors get jammed.The new approach would end these jams by building layers of logic atop layers of memory to create a tightly interconnected high-rise chip. Many thousands of nanoscale electronic “elevators” would move data between the layers much faster, using less electricity, than the bottle-neck prone wires connecting single-story logic and memory chips today.The work is led by Subhasish Mitra, Philip Wong and Inez Kerr Bell. The researchers' innovation leverages three breakthroughs.The first is a new tech for creating transistors, those tiny gates that switch electricity on and off to create digital zeroes and ones. The second is a new type of computer memory and the third is a technique to build these new logic and memory techs into high-rise structures in a radically different way than previous efforts to stack chips.

“This research is at an early stage, but our design and fabrication techniques are scalable,” Mitra said. “With further development this architecture could lead to computing performance that is much, much greater than anything available today.” Wong said the prototype chip shows how to put logic and memory together into three-dimensional structures that can be mass-produced. “Paradigm shift is an overused concept, but here it is appropriate,” Wong said. “With this new architecture, we could put the power of a supercomputer in your hand.”

Engineers have been making silicon chips for decades, but the heat emanating from phones and laptops is evidence of a problem. Even when they are switched off, some electricity leaks out of silicon transistors. Users feel that as heat. But at a system level, the leakage drains batteries and wastes electricity. Researchers have been trying to solve this major problem by creating carbon nanotubes ­ or CNT ­ transistors. They are so slender that nearly 2 billion CNTs could fit within a human hair. CNTs should leak less electricity than silicon because their tiny diameters are easier to pinch shut. Mitra and Wong have managed to make some of the highest performance CNT transistors ever built. They did this by solving a big hurdle: packing enough CNTs into a small enough area to make a useful chip.

Until now the standard process used to grow CNTs did not create a sufficient density of these tubes. The Stanford engineers solved this problem by developing an ingenious technique.They started by growing CNTs the standard way, on round quartz wafers. Then they added their trick. They created what amounts to a metal film that acts like a tape. Using this adhesive process they lifted an entire crop of CNTs off the quartz growth medium and placed it onto a silicon wafer. This silicon wafer became the foundation of their high-rise chip.

Creating high-performance layers of CNT transistors was only part of their innovation. Just as important was their ability to build a new type of memory directly atop each layer of CNTs.Wong is a world leader in this new memory technology. Unlike today's memory chips, this new storage technology is not based on silicon. Instead, the Stanford team fabricated memory using titanium nitride, hafnium oxide and platinum. This formed a metaloxidemetal sandwich. Applying electricity to this threemetal sandwich one way causes it to resist the flow of electricity. Reversing the electric jolt causes the structure to conduct electricity again.The change from resistive to conductive states is how this new memory technology creates digital zeroes and ones. The change in conductive states also explains its name: resistive random access memory, or RRAM.

Wong designed RRAM to use less energy than current memory, leading to prolonged battery life in mobile devices. Inventing this new memory technology was also the key to creating the high-rise chip because RRAM can be made at much lower temperatures than silicon memory.

Max Shulaker and Tony Wu, Stanford students, created the tech behind the four-story high-rise chip. Everything hinged on the low-heat process for making RRAM and CNTs, which enabled them to fabricate each layer of memory directly atop each layer of CNT logic. While making each memory layer, they were able to drill thousands of interconnections into the logic layer below.This multiplicity of connections is what enables the high-rise chip to avoid the traffic jams on conventional circuit cards.There is no way to tightly interconnect layers using today's conventional silicon-based logic and memory. That's because it takes so much heat to build a layer of silicon memory ­ about 1,000 degrees centigrade ­ that any attempt to do so would melt the logic below.The article is published in

Previous efforts to stack silicon chips could save space but not avoid the digital traffic jams.That's because each layer would have to be built separately and connected by wires ­ which would still be prone to traffic jams, unlike the nanoscale elevators in the Stanford design. 

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